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    • 专利摘要:
    The present invention relates to a laminated vehicle (100) comprising: a first glazing unit (1 '), forming an outer glazing unit, with first and second main faces (11', 12 ') respectively said face F1 and face F2 - an interlayer laminating material (2) of polymeric material having a thickness e1 of at most 1.8 mm - a second glazing unit (1), forming an internal glazing unit, with third and fourth main faces (11, 12) respectively called face F3 and face F4 the face F2 and the face F3 being the internal faces of the laminated glazing unit - a set of diodes (4) housed in through openings (20) of the lamination interlayer.
    公开号:FR3051715A1
    申请号:FR1600850
    申请日:2016-05-26
    公开日:2017-12-01
    发明作者:Pascal Bauerle
    申请人:Saint Gobain Glass France SAS；Compagnie de Saint Gobain SA；
    IPC主号:
    专利说明:

    LUMINOUS LIGHT ROOF OF VEHICLE, INCORPORATING THE VEHICLE
    The invention relates to a luminous laminated glass roof vehicle and a vehicle with such a roof and the manufacture of such a roof.
    There are more and more glazed car roofs, some able to bring the mood light. The light comes directly from the light-emitting diodes inserted into the laminated glazing.
    More specifically, the document WO2013189794 in the embodiment in connection with FIG. 1 comprises a luminous glazed automotive roof comprising: a laminated glazing unit comprising: a first glazing unit forming external glazing with first and second main faces often called Fl and F2
    a laminating interlayer in the form of three sheets of PVB; a second glazing forming an internal glazing unit with third and fourth main faces often called F3 and F4; the second and third faces being the internal faces of the glazing; a set of diodes on a support; thin film which is a glass slide having a conductive oxide layer power supply circuit - each diode having an emitting face emitting towards the inner glass, - the central sheet of the lamination interlayer having a through opening arranged all around the glass slide for its integration.
    The scrap rate of this glazing can be improved and therefore the reduced manufacturing cost. The invention thus aims at a more robust glass roof, or even more compact and / or simple to manufacture For this purpose, the present application has as its first object a luminous laminated glass roof vehicle including automotive or public transport including: - a laminated glazing comprising: a first glazing (transparent), of mineral glass, optionally clear, extraclear or preferably tinted in particular gray or green, preferably curved, intended to be the outer glazing, with first and second main faces respectively said face Fl and face F2, for the motor vehicle, with a thickness preferably of at most 2.5 mm, even at most 2.2 mm, in particular 1.9 mm, 1.8 mm, 1.6 mm and 1.4 mm, or not more than 1.3 mm or not more than 1 mm - a second glazing (transparent), made of mineral glass, preferably curved and preferably clear or extraclear or even tinted (less than the first glazing), glazing intended to be glazed l e interior, with third and fourth main faces respectively face F3 and face F4, for the motor vehicle, thickness preferably lower than that of the first glazing, even at most 2mm - especially 1.9mm, 1.8mm, 1.6mm and 1.4mm- or even at most 1.3mm or less than 1.1mm or even less than 0.7mm especially of at least 0.2mm, the total thickness of the first and second glazings preferably being less than 4 mm, even at 3.7 mm, the second glazing being chemically quenched between the faces F2 and F3 which are the internal faces of the laminated glazing a lamination interlayer, possibly clear, extraclair or even tinted including gray or green (tinted especially if through apertures), polymeric material preferably thermoplastic and preferably polyvinyl butyral (PVB), laminating interlayer film having a main face FA side F2 and a main face FB side face F3 the face FA may be in adhesive contact with the face F2 (bare or coated) and the face FB be in adhesive contact with the face F3 (bare or coated), of thickness Ea between the FA face and FB -which for the motor vehicle- is preferably at most 1.8mm, better at most 1.2mm and even at most 0.9mm (and better still at least 0.3mm and even at least 0.6 mm), in particular at the back of the edge of the first glazing of at most 2 mm and at the recess of the edge of a second glazing of at most 2 mm, in particular being a first acoustic and / or tinted sheet - at least one inorganic light-emitting diode or preferably a set of N> 1 inorganic light-emitting diodes, each diode comprising at least one semiconductor chip, preferably in an envelope (packaging), each chip being (having at least one emitting face = suitable for transmit towards the face F3, and each diode including a slice and a front surface (in the plane of the front of the packaging) and even preferably a diode having a width W4 (maximum dimension normal to the optical axis) of at most 10 mm and even at most 8 mm and even at most 8mm, each diode being of thickness e2 submillimetric and greater than 0.2mm
    Said laminating interlayer is provided between the face FA and the face FB of one or a set of M openings which are preferably through or blind holes, each opening being of width Wa (greater than or equal to that of the diode in the aperture) of not more than 20mm and not more than 15mm.
    Each diode is associated with a through opening or a blind hole accommodating (surrounding the edge of) the diode or in that at least one group of said diodes being associated with the same common said through opening or a so-called common blind hole, housing the group of diodes
    Diodes of said set of diodes, or all of the diodes may be on the face F2 or on the front face of a flexible support said diode support (s) of thickness e2 submillimeter and greater than 0.2mm, between the face FA and the face F2 and / or diodes of said set of diodes are inversely mounted on the face F3 or on the rear face of a flexible support said diode support (s) of thickness e2 submillimeter and greater than 0.2mm between face FB and face F3.
    In particular: -when the opening is through and the face FB in contact with the face F3, the front surface of) the diode is recessed preferably from the face F3 -when the opening is through, when a diode is in reverse assembly and the face FA is in contact with the face F3, the diode is preferably set back from the face F2 (of the face FA), -when the hole is blind the remaining base thickness Hf is preferably at least 0.2mm.
    Also, the present invention provides local cutouts of the laminating interlayer dedicated to the diodes. In particular, it avoids the total cut around the diode support (s) (PCB) as practiced in the prior art increases the risk of poor assembly (bubbles, delamination, aesthetic defects).
    In particular the support is flexible and thin enough not to necessarily add a leaflet type PVB rear side. The group of diodes in a common hole can be inscribed on a surface S of width or length of at most 20mm. The lamination interlayer is preferably closer to the diodes and preferably taking into account the positioning tolerance of the diodes during the selected cutting preferably wider than the width of the diodes (even if the interlayer has flexibility ). The laminating interlayer with through opening between the face FA and FB can be as thin as possible relative to the diodes to avoid the risk of generating too many air bubbles.
    It may be preferable to use a single sheet (PVB) for the interlayer for economic reasons (material cost and simply a series of local cuts to make). The use of a single sheet (PVB) preferably of standard thickness 0.78mm or 0.81mm (for more security rather than 0.38mm) is made possible by the choice of new ultrathin power diodes, very recently available on the market. The laminating interlayer may have between the face F2 and F3 a total thickness And at most 1.8mm, better at most 1.2mm and even at most 0.9mm (and better at least 0 , 3mm and even at least 0.6 mm), in the form of one or more sheets (preferably two sheets or at most three sheets), in particular a clear or tinted acoustic sheet (preferably three-layer or even four-layer or more) ). These sheets may be in contact in an area (excluding possible diode support area (s) and / or spaced (plastic film AND covering etc.) And may be the sum of the thicknesses of sheets in contact or disjoint.
    In a preferred embodiment, the thickness between the face FA and the face FB is subcentimetric, preferably between 0.7 and 0.9 mm, the total thickness of PVB Etot between F2 and F3 is subcentimetric The interlayer Laminating can be acoustic PVB especially three-layer.
    In particular, in one embodiment, the lamination interlayer is formed from a single sheet (clear, extraclear or tinted), preferably PVB, with the openings preferably through, and the back side and against or glued on the face F2. The single leaflet can be an acoustic PVB.
    In another embodiment, a thermoplastic sheet, preferably PVB, is present between the rear face of the diode support (s) and the face F2 or the face F3 in reverse mounting, preferably sheet thickness of plus 0.4mm, or especially tinted acoustics if face side F2
    One can use a first sheet with the through openings or the blind holes and we add a second sheet (which may be thinner than the first sheet) back side of the diode support (s). This second sheet is preferably of the same extent as the sheet with the through openings. This second sheet may be of thickness of at most 0.38 mm and even at most 0.2 mm, especially clear, extraclair or tinted. The first sheet may be an acoustic PVB, preferably clear (etraclair), preferably between 0.6 and 0.9mm.
    Conversely, the second sheet may be between 0.7 and 0.9 mm thick and even thicker than or equal to the first sheet. In particular the first sheet is clear and the second sheet is an acoustic PVB especially tinted.
    As mentioned above, two (or more) leaflets (preferably PVB) can be used as indicated for mechanical reinforcement. For example: a first sheet, for example tinted (preferably PVB for example acoustic), with through openings of thickness of at most 0.4 mm, a second sheet thickness of at most 0.4 mm, m , and not more than 0.2mm, in particular 0.19mm
    If the diodes (and the diode support (s)) are thin enough we can even reverse. For example - a first sheet (preferably of PVB) with through apertures with a thickness of at most 0.4 mm and even at most 0.2 mm, - a second sheet (preferably of PVB) with a thickness of 'not more than 0,4mm,
    In a preferred embodiment, the walls of one or more through openings or blind holes are spaced at most 0.5 mm better than at most 0.2 mm or even 0.1 mm from the edge of the diode or diodes of said group housing there and even is in contact with the edge of the diode or diodes said group iogeant.
    A diode may be of the "chip on board" type or even more preferably a surface mounted component (SMD in English) then comprising a peripheral envelope (often referred to as "packaging").
    In a preferred embodiment, each diode, preferably of power, being an electronic component including at least one semiconductor chip, and is equipped with a peripheral envelope (often called "packaging"), polymeric or ceramic, encapsulating the slice of the electronic component (and defining the slice of the diode), surrounding the semiconductor chip. The envelope may correspond to the maximum thickness (height) e2 of the diode. The envelope is for example epoxy. A polymeric envelope may eventually settle (the final thickness after lamination may be less than the initial thickness) during the lamination. The (polymeric) envelope may be opaque. The envelope (monolithic or two-piece) may comprise a carrier base portion of the chip and a reflector portion flared away from the base higher than the chip, and containing a protective resin and / a material with color conversion function. The front surface can be defined as the surface of this material covering the recessed chip or at the "front" surface of the reflector.
    In a preferred embodiment, each diode, preferably of power, being an electronic component including the semiconductor chip, and is equipped with a peripheral envelope (often called "packaging"), polymeric or ceramic, encapsulating the edge of the electronic component, projecting and surrounding the semiconductor chip, envelope defining the edge of the diode and the front surface of the diode) - the lamination interlayer (by creep during the lamination) extends to be between the so-called front surface of the envelope and the face F3 without going to the front face of the diode (transmitting face of the chip or face of the chip assembly and protective covering material or to conversion function of longer than wave, optionally the electronic component comprises a so-called lower portion carrying ia or chip-semiconductors and with a top portion flared towards F3 Folio interlayer age (2) extends to be between said front surface of the envelope and the face F3 without being in contact with the emitting face of the chip, the width of the opening W 'in the plane of the front surface being smaller than W and greater than the width W'2 of the emitting face of the chip The envelope may correspond to the maximum thickness (height) e2 of the diode. The envelope is for example epoxy. A polymeric envelope may eventually settle (the final thickness after lamination may be less than the initial thickness) during the lamination. The (polymeric) envelope may be opaque.
    The diode may comprise a protective resin or a color conversion function material, typically on the semiconductor chip. The semiconductor chip can be embedded in a material (resin, etc.). The envelope may have a flared profile away from the chip and the space between the chip and the envelope may contain a protective resin or a conversion function material.
    The chip on board (SMD) may be devoid of optical element (lens etc) above the chip-semiconductor (embedded or not in the material) to facilitate compactness
    Before lamination, the lamination interlayer can be spaced not more than 0.5 mm better than at most 0.1 mm from the edge of the diode and after lamination, because of creep the lamination interlayer may be less spaced and even in contact with the wafer and even overflow on the front of the component by surrounding the semiconductor chip.
    Preferably ia or the diodes are surface-mounted components on the front face of the diode support (s) and even the diode (s) have a lambertian or quasi-lambertian emission.
    In a preferred embodiment, the thickness, preferably PVB, between face FA and face FB is from 0.7 to 0.9 mm (a single sheet or a first and second sheet) is made of PVB, the diodes are surface mounted components on the front face of the diode support (s), e2 is not more than 0.2mm better than 0.15mm and not more than 0.05mm.
    The width of the diode support (s) such as the PCB is preferably at most 5 cm, better at most 2 cm, and even at most 1 cm. The width (or length) of a diode with a single semiconductor chip, generally a square diode, is preferably at most 5 mm. The length of a diode with a plurality of semiconductor chips (typically surrounded by the envelope), generally rectangular in shape, is preferably at most 20mm better than 10mm or less.
    Especially in the case of a single sheet -with through openings-including a PVB possibly acoustic, tinted or clear), the diode support (s) (flexible enough to adapt to the curved laminated glazing) can be glued or plated against the face F2 or the face F3 in reverse assembly, é2 is at most 0.15mm and even at most 0.1mm, especially adhesive bonding (glue or preferably double-sided adhesive), e3 thickness with e3 ^ 0.1mm, better e3s0,05mm -even such that e3 + e2 is at most 0.15mm better than at most 0.1mm-.
    With this adhesive we prefer e3 + and e2 (especially if present on the back of the PCB in the area of the diodes).
    The bonding is along the entire length of the support or punctual, in diode area and / or off diodes. The adhesive on the periphery can seal with liquid water.
    The diode support (s) may be local and possibly with through openings to make it more discreet.
    The roof may comprise a sheet, in particular of the lamination interlayer, made of thermoplastic material between the rear surface of the diode support (s) and the face F2 or the face F3 in reverse assembly. The lamination interlayer formed from one or more films - between the face FA and FB and / or sheet on the back and / or still sheet between the face FB and the face F3 - may be made of polyvinyl butyral (PVB), polyurethane (PU), copolymer ethylene / vinyl acetate (EVA), having for example a thickness between 0.2mm and 1.1mm.
    One can choose a classical PVB as the RC41 of Solutia or Eastman. The lamination interlayer between the face FA and FB and / or sheet on the back and / or still sheet between the face FB and the face F3 may comprise at least one so-called central layer of viscoelastic plastic material with vibration damping properties. and acoustics, especially based on polyvinyl butyral (PVB) and plasticizer, and the interlayer, and further comprising two outer layers in standard PVB, the central layer being between the two outer layers. As an example of an acoustic sheet, patent EP0844075 can be cited. Acoustic PVB described in the patent applications WO2012 / 025685, WO2013 / 175101, especially stained as in WO2015079159.
    Preferably, the roof has at least one of the following characteristics - the aperture preferably through is in a thickness of PVB (one or more sheets, with discernable interface in particular) - the aperture preferably through is in a spacer of acoustic laminating, in particular three-layer or four-ply - preferably through aperture is in a tinted interlayer (including masking a little diode support (s - the opening is in a composite material (multifilettes): PVB / plastic film transparent or PVB / transparent plastic film / PVB, said plastic film, in particular a PET, submillimeter thickness being carrying a functional coating: low emissivity or solar control and / or heating - the spacing between through openings is d at least 0.1 mm or better still of at least 0.2 mm and preferably at most 50 cm for a binding function - the spacing between diodes of separate through apertures of at least 0.1 mm or better still of at least 0.2 mm - the spacing between diodes in a through or common aperture is at least 0.1 mm or better at least 0.2mm and not more than 1mm
    Naturally, the face FB or another layer of PVB may be in direct contact with the face F3 (respectively F2) or with a functional functional coating on this face, in particular a stack of thin layers (including one or more silver layers) such that : heating layer, antennas, solar control layer or low emissivity or a decorative layer or masking (opaque) as a generally black enamel.
    The preferably internal glass, especially thin with a thickness of less than 1.1 mm, preferably quenched chemically. It is preferably clear Examples of applications WO2015 / 031594 or WO2015066201 may be cited.
    The diodes are preferably power diodes which are in operation electrically powered under current, preferably with a factor of at least 10 and even at least 20 (thus intensity / 10 or even intensity / 20), especially in order to maintain a temperature below the softening temperature of the polymeric material of the lamination interlayer, in particular at most 130 ° C, more preferably at most 120 ° C and even at most 100 ° C.
    These diodes guarantee excellent efficiency without overheating.
    For example, for diodes fed with IA current, one chooses between 50 and 100 mA.
    Inorganic diodes are for example based on gallium phosphide, gallium nitride, gallium and aluminum.
    The diode support (s) (PCB) can be sufficiently flexible (flexible) to accommodate the curvatures of the curved laminated glazing.
    In one embodiment, the diode support (s) comprises a preferably transparent plastic film, preferably poly (ethylene terephthalate) or PET or polyimide, provided with conductive tracks, in particular metallic tracks (copper, etc.), or transparent conductive oxide, preferably transparent and equipped with surface-mounted diodes. The conductive tracks are printed or deposited by any other deposit method, for example physical vapor deposition. The conductive tracks can also be wires. It is preferred that the conductive tracks and the film be transparent when they are visible, that is to say that they are not masked by a masking element (layer) (such as an enamel or a paint, etc.) in particular. opposite F4 or F3. The conductive tracks can be transparent by the transparent material or by their width sufficiently fine to be (almost) invisible.
    Polyimide films have a higher temperature with respect to the alternative PET or even PEN (polyethylene naphthalate).
    The diode support (s) may be local or essentially cover the faces F2 and F3 and preferably carrying a functional coating low emissivity or solar control and / or heating.
    Preferably, the diode support (s) alone or associated with a flat connector extends at least up to the edge of the laminated glazing, and preferably protrudes from the wafer, for example the diode support (s) comprises with a first portion with the diode (s) and a narrower portion emerging from the glazing, and between the rear face of the diode support (s) and the face F2, is housed a liquid-tight adhesive with a thickness of plus 0.1mm and better not more than 0.05mm, including a double-sided adhesive. Such an adhesive is preferred to an overmolding solution. It may be the preferably transparent adhesive used to fix (all) the diode support (s).
    The diode support (s) may comprise: - a first portion (rectangular) carrying the diode or diodes - and a second portion for the (rectangular) connection opening and even protruding on the edge of the laminated glazing.
    This second part can be (much) longer than the first part and / or less wide than the first part.
    Preferably, the first part is at least 2mm wide. The diode support (s) can be angled in particular in L shape
    The diode support (s) can be associated with a flat connector extending up to and even beyond the edge of the glazing, preferably a flexible connector adapted to the curvature of the glazing, comprising a plastic, for example PEN, polyimide the flat connector may be of width (dimension along the wafer) less than or equal to the dimension of the diode support (s) along the wafer
    The glazing may comprise several groups of diodes (and therefore preferably through openings) with the same function or separate functions.
    The diodes (on a diode support (s)) may emit the same light or a different color light, preferably not at the same time.
    To have a larger luminous area and / or different colors one can have - on the same diode support (s) - several rows of diodes or even attach two diode support (s) (at least attach the first parts of the supports diode (s) with diodes).
    Preferably, said set of diodes of the glass roof (road vehicle preferably) forming at least one of the following light areas: - a light zone forming a reading light or ambient lighting, driver's side and / or co-pilot or passenger ( s) rear (s), - a decorative light zone - a luminous area including signage including letter (s) and / or pictogram (s), in particular for network connectivity, co-pilot side or passenger (s) rear (s).
    Preferably, diodes of said assembly form a reader and are preferably in through apertures and / or on the diode support between face F2 and face FA.
    Preferably the diode (alone or one of the diodes of said set) forms a light indicator of a touch switch remote side face F3 and facing the diode, the diode forming said light indicator is preferably on the diode support having diodes together - preferably a reader-reader - between the face F2 and the face FA.
    The diodes forming a reading light (reading light) are along a longitudinal or lateral edge of the roof - in (at least) a row forming a light band. - round, or square or even cross or any other shape.
    It is possible to have a diffusing or forming layer of the diode which is a light indicator of a switch (preferably capacitive) of an electrically controllable device: diodes forming a binder, optical valve ("SPD"), heating layer, etc.
    The diode support (s) can be in the clear glass, spaced or not opaque peripheral bands (even forming opaque frame) as a masking enamel (black, dark etc.). Most often, there is an opaque layer opposite F2 and an opaque layer opposite F4 or F3. Their widths are identical or distinct.
    The width Li of an opaque peripheral band opposite F2 and / or F3 and / or F4 is preferably at least 10 mm and even 15 mm. Also, the length of the diode support may be greater than Li.
    The diode support (s) (at least the portion with the diode (s) or at least the portion without the diodes) can be arranged in or near the region of an opaque layer, especially an enamel (black), the along a peripheral edge of the laminated glazing, generally face F2 and / or face F4 or face F2 and / or face F3.
    Also, in a first embodiment, the diode support (s) can even be arranged in a region of the roof in which the outer glass is entirely (or partially) opaque by the opaque (outermost) layer, such as an enamel (black), in F2. This opaque layer may be in this region of the roof a solid layer (continuous bottom) or a layer with one or discontinuities (surfaces without an opaque layer) for example layer in the form of a set of geometric patterns (round, rectangle, square etc), or not, of identical or distinct size (more or smaller in size away from the wafer and / or patterns of more or more spaced away from the wafer).
    In this first embodiment, the diode (s) or even the diode support (s) may be visible only inside and thus masked by the opaque layer opposite F2.
    The diode support (s) can be arranged in a region of the roof in which the inner glass is opaque by an opaque layer (the innermost) as an enamel (black) preferably F4 or F3. This opaque layer then comprises at least one or more savings (by a depot mask or by laser removal in particular) to the right of each diode. This opaque layer, for example, is in the form of a set of opaque geometric or non-geometric patterns (in a circle, rectangle, square, etc.), of identical or distinct size (of a larger or smaller size and / or with patterns of more or more spaced apart from the edge). Areas between the opaque patterns are at the right of the diodes.
    As diodes can be mentioned the range of OSLON BLACK FLAT sold by OSRAM. For the red light, there may be mentioned as a diode sold by OSRAM: OSLON BLACK FLAT Lx H9PP. For orange light (amber), there may be mentioned as a diode sold by OSRAM: LCY H9PP. For white light, the diode sold by OSRAM is: LUW H9QP or KW HxL531 .TE where x = is the number of chips in the diode (for example 4 or 5).
    Flexible PCBs include the range of AKAFLEX® products (including PCL FW) from KREMPEL.
    In one embodiment of the vehicle, it comprises at least one control unit for driving the diodes and even at least one sensor in particular for detecting the brightness. A control unit for driving the diodes may be in the laminated glazing, on or off the diode support (s).
    Preferably, the glazed roof according to the invention meets the current automotive specifications, in particular for the light transmission T1 and / or the energy transmission Te and / or the energy reflection Re and / or for the total transmission of the solar energy TTS.
    For an automotive roof, one or more of the following criteria are preferred: -Te of not more than 10% and even of 4 to 6%, -Re (preferably Fl side side) of not more than 10%, better than 4 at 5% -and TTS <30% and even <26%, even 20 to 23%.
    The T1 can be low, for example, at most 10% and even 1 to 6%.
    In order to limit heating in the passenger compartment or to limit the use of air conditioning, at least one of the glazings (preferably the outer glass) is tinted, and the laminated glazing may also include a layer of reflective or absorbent solar radiation, preferably face F4 or face F2 or F3, in particular a transparent electroconductive oxide layer called TCO layer (face F4) or even a thin film stack comprising at least one TCO layer, or d stacks of thin layers comprising at least one layer of silver (in F2 or F3), the or each silver layer being disposed between dielectric layers.
    One can cumulate layer (silver) face F2 and / or F3 and TCO layer F4 face.
    The TCO layer (of an electrically conductive transparent oxide) is preferably a fluorine-doped tin oxide layer (SnO2: F) or a tin-indium mixed oxide (ITO) layer. Other layers are possible, among which thin layers based on mixed oxides of indium and zinc (called "IZO"), based on zinc oxide doped with gallium or aluminum, based on Niobium doped titanium oxide, based on cadmium or zinc stannate, based on antimony-doped tin oxide. In the case of aluminum doped zinc oxide, the doping level (i.e., the weight of aluminum oxide based on the total weight) is preferably less than 3%. In the case of gallium, the doping rate may be higher, typically in a range of 5 to 6%.
    In the case of ΓΙΤΟ, the atomic percentage of Sn is preferably in a range from 5 to 70%, especially from 10 to 60%. For the fluorine-doped tin oxide-based layers, the atomic percentage of fluorine is preferably at most 5%, usually 1 to 2%. ITO is particularly preferred, particularly with respect to SnOaiF. Higher electrical conductivity, its thickness may be lower to achieve the same level of emissivity. Easily deposited by a cathodic sputtering method, especially assisted by magnetic field, called "magnetron process", these layers are distinguished by a lower roughness, and therefore a lower fouling.
    One of the advantages of fluorine-doped tin oxide is its ease of deposition by chemical vapor deposition (CVD), which in contrast to the sputtering process, does not require any subsequent heat treatment, and can be implemented on the float flat glass production line.
    "Emissivity" means the normal emissivity at 283 K in the sense of EN 12898. The thickness of the low-emissivity layer (TCO etc.) is adjusted, depending on the nature of the layer, so as to obtain the desired emissivity, which depends on the desired thermal performance. The emissivity of the low-emissivity layer is, for example, less than or equal to 0.3, in particular to 0.25 or even to 0.2. For ITO layers, the thickness will generally be at least 40 nm, or even at least 50 nm and even at least 70 nm, and often at most 150 nm or at most 200 nm. For fluorine-doped tin oxide layers, the thickness will generally be at least 120 nm, even at least 200 nm, and often at most 500 nm.
    For example, the low-emissivity layer comprises the following sequence: high-index sub-layer / low-index sub-layer / an optional TCO-dielectric overcoat layer.
    As a preferred example of a low-emissivity layer (protected during quenching), it is possible to choose high-index sub-layer (<40 nm) / low-index underlayer (<30 nm) / an ITO layer / high-index overcoat (5-15 nm) )) / overlay low index (<90 nm) barrier / last layer (<10 nm).
    As low-emissivity layer, those described in the US2015 / 0146286 patent can be mentioned on the F4 side, in particular in Examples 1 to 3.
    In a preferred embodiment: - the first and / or second glazing is tinted and / or the lamination interlayer is tinted on all part of its thickness (especially outside the side of the brightest surface, often the one with the alterations) - and / or one of the faces F2 or F3 or F4 - preferably the face F4 - of the glazed roof, is coated with a low emissivity layer, in particular comprising a transparent electrically conductive oxide layer (TCO ) in particular a thin film stack with TCO layer or a stack of thin layers with layer (s) of silver - and / or one of the faces F2 or F3 or F4 - preferably the face F3 - of the glazed roof, is coated with a solar control layer, in particular comprising a transparent electrically conductive oxide layer (TCO), in particular a thin film stack with a TCO layer or a stack of thin layers with a silver layer (s), and / or or an additional film (polymeric, c Like a tinted PET polyethylene terephthalate etc) is between the faces F2 and F3 or (glued) in F4 or face F1.
    In particular, the face F4 of the glass, is coated with a transparent functional layer including low emissivity, preferably comprising a TCO layer, including a zone (electrically powered, therefore electrode) forming a touch button (for controlling the first light surface). The invention of course relates to any vehicle having at least one roof as described above. Finally, the invention relates to a roof manufacturing method as described above that comprises the following steps: - cutting for example automatic (robotic) of the lamination interlayer - in the form of a single sheet (PVB preferably and even acoustically, tinted or not) or a composite PVB / functional plastic film or PVB // functional plastic film / PVB preferably at most 0,9mm and even at most 0,4mm to form openings local throughbands (geometric: round, square, rectangular, in particular of the same shape as the diodes), preferably as many (and not more) openings as diodes - or the lamination interlayer (PVB preferably) having a first sheet and a second sheet, in particular of not more than 0.4 mm and not more than 0.2 mm, cutting (automatic) of the first sheet of not more than 0.9 mm to form local through-holes, - assembly of the sheet-glass illuminated, with openings larger than the size of the diodes preferably greater than 1mm, better not more than 0.5mm or not more than 0.2mm or not more than 0.1mm, l possible second sheet being between the rear face of the PCB and the face F2.
    The placement of the diodes on the front panel can be manual or robotic (more precise).
    The diode support (s) with the diodes can be positioned relative to the glazing (rear side of the support) and constrain the introduction of the perforated lamination interlayer with preferably a cut of the lamination interlayer with excess on the outline of the glazing (and cutting the excess after placing the glazing on the front side), or the diode support (s) with the diodes can be positioned relative to the perforated lamination interlayer and is constrained by the establishment of the latter and preferably with a cut of the laminating interlayer to the exact shape of the laminated glazing.
    The present invention is now explained in more detail with reference to the appended figures in which:
    FIG. 1 shows a view from above of a luminous laminated glazed roof of a motor vehicle according to a first embodiment of the invention and a detailed view of the diodes forming a reading lamp.
    Figure 1 'shows a partial schematic sectional view of the laminated glazed roof in a variant of the first embodiment of the invention.
    Figure 1 "shows a partial schematic sectional view of the laminated glazed roof in a variant of the first embodiment of the invention.
    FIGS. 1a, 1b, 1c and 1d show the front views of diode supports on the internal side (towards the passenger compartment)
    FIG. 1 shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention.
    FIG. 1 shows a perspective view of a PVB of the through apertures in the case of row diodes.
    Figures 1i, 1j, 1k, 11, 1m, In, 1o show partial schematic, exploded, sectional views of the luminous laminated glazed roof according to the invention, illustrating methods of manufacture.
    FIG. 1a shows an exploded partial schematic sectional view of the laminated glazed roof according to one embodiment of the invention
    FIG. 2 shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention.
    FIG. 2 'shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention.
    FIG. 3 shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention.
    FIG. 4a shows a partial schematic sectional detail view of the laminated glazed roof according to one embodiment of the invention and FIGS. 4b and 4c examples of the reverse-mounted diodes respectively in bottom view or in perspective view.
    FIG. 5a shows a partial diagrammatic sectional detail view of the laminated glazed roof according to a variant of the embodiment of the invention of FIG. 4a.
    FIG. 6a shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention, a variant of the embodiment of the invention of FIG. 4a.
    FIG. 1 shows a view from above of a luminous laminated glazed roof of a motor vehicle 1000 according to a first embodiment of the invention with two sets of diodes 4 forming for one a reading lamp at the rear and for the other in the front.
    A first set of eight diodes 4 (see the detail view) is on a first printed circuit board called PCB (not shown here) integrated between the two glazing of the laminated glazing, eight diodes forming a round disposed in the clear glass in a longitudinal edge area in the vicinity of an outer masking peripheral area (opaque enamel) of the outer glazing and an inner masking area (opaque enamel) of similar size of the non-visible inner glazing. Alternatively, the reading lamp is masked by the layer 15 'and one or more savings are made in the internal masking zone or even is in a (transition) zone with alternating masking zone (opaque layer, such as an opaque enamel) and transparent area of the interior glazing,
    Figure 1 'shows a partial schematic sectional view of the laminated glazed roof in a variant of the first embodiment of the invention. The laminated glazed roof, curved, comprising: a first glazing 1, for example glass VG10 and 2.1mm thick, forming an outer glazing unit, with first and second main faces 11, respectively face Fl and face F 2 - a second glazing 1 'forming internal glazing for example TSA glass (or clear or extraclair) and 2.1mm thick or even 1.6mm or even less than 1.1 mm (especially tempered glass chemically), with third and fourth main faces 13, 14 respectively said face F3 and face F4, the face F3 optionally coated with a functional layer (heating, low emissivity, etc.),
    between the face F2 and the face F3 forming the inner faces 12, 13 of the laminated glazing a laminating interlayer 20 made of polymeric material, here made of PVB, of thickness and submillimetric, preferably of about 1 mm or less, comprising one face FB in adhesive contact with the face F3 and a set of through openings (here two visible) between a face FA against a diode support 3 and the face FB, the thickness Ea between these faces FA and FB corresponds to the height of the openings H for example of about 0.76mm for a conventional PVB (RC41 Solutia or Eastman) alternatively if necessary an acoustic PVB (tricouche or quadricouche) for example of thickness 0.81 mm about a functional layer 16 for example low emissivity in front F4 (ITO etc).
    Inorganic light-emitting diodes 4 are surface mounted components (SMD or SMD in English), on the support of diodes, for example emitting in the white.
    The diode support may be a printed circuit board called PCB 3 of thickness e2 of at most 0.2 mm and preferably from 0.1 mm to 0.2 mm.
    The so-called front face 30 of the diode support 3 carries conductive tracks opposite the face F3 and the rear face 30 'is against the face F2 or face 12. Each diode has a transmitting face emitting towards the inner glazing 1' , and each diode having a slice.
    For each of the diodes, the lamination interlayer thus comprises a through opening 20a surrounding the wafer of the diode and even in contact with its wafer or alternatively spaced apart by at most 0.5 mm and even at most 0.1 mm from the slice.
    The diodes 4 (with a single semiconductor chip here) are of square shape with a width of the order of 5 mm or less. The diodes are of thickness e2 less than the height of the hole H. The diodes are not in excess thickness at the risk of weakening the glass by creating points of stress. And the diodes preferably should not be too far from the face F3 at the risk of creating too much air bubbles.
    We choose a PCB as thin as possible, flexible and in the case shown here or the diodes 4 are in the glass clear (out of the periphery with the external and internal masking layers 15 and 15 ') even preferably the most discrete possible (minimum width or even transparency) for example comprising a transparent film such as a PET, PEN or a polyimide and even for the printed circuit transparent connection tracks (rather than copper or other metal except to make them sufficiently thin) .
    During manufacture, for example, a first sheet 21 with the through openings and a second sheet of PVB 22 on the back side of the PCB are chosen. By creep the two sheets are contiguous with or without a discernable interface (here in dashed lines).
    The layer 16 may have a touch switch area to turn on the reading light.
    FIG. 1 "shows a partial schematic sectional view of the laminated glazed roof in a variant of FIG. 1 'in which - a functional layer 17, for example a heating layer, faces F3. the layer opposite F4 is eventually removed
    The layer 17 may have a touch switch area to turn on the reading light.
    It is possible to add on the support 3 a light indicator diode of the touch switch zone and its associated through opening.
    FIGS. 1a, 1b, 1c, 1d show the front views of diode-side supports on the inner face (facing the passenger compartment) with different arrangements of diodes.
    The PCB 3 comprises a first diode-carrying part, and a narrower part of power supply opening beyond the edge of the roof, in the figure we use nine diodes including eight diodes 4 in round forming a reader and a central 4'b FIG. 1b shows the use of nine diodes, including eight diodes 4 in the form of a reading light, and a central 4 'forming a light indicator, and a 3d part of the support is hollowed out for more discretion in FIG. 1c, using fifteen diodes including fourteen square diodes 4. 11 and forming a central control unit 4 'forming a light indicator in FIG. 1d, seventeen diodes are used, of which sixteen diodes 4 in the form of a reading light and a central 4' forming a light indicator in FIG. A row of six diodes 4 and for example the support 3 is bent, in L with a sealing adhesive 6 if against the face F2,
    Figures 1i, 1j, 1k, 11, 1m, 1n, 1o show partial schematic, exploded, sectional views of the luminous laminated glazed roof according to the invention, illustrating methods of manufacture.
    In Figure 1i, using a single PVB sheet with through openings, which sheet may be conventional and / or acoustic and / or tinted.
    In FIG. 1J, use is made of: a first PVB sheet 21 with the through-openings, which sheet may be conventional and / or acoustic and / or tinted, and a second PVB sheet 22 on the rear face of the support 3, which sheet may be conventional for example tinted and thinner than the first sheet (taking into account the thickness of the diodes).
    In FIG. 1 k, use is made of: a first PVB sheet 21 with the through-openings, which sheet may be conventional and / or acoustic and / or tinted. a transparent film 3 (PET etc.) carrying a functional layer 33 'facing F3 (or alternatively face F2), for example low emissivity or solar control, here, for example, preassembled with another PVB sheet 23 (thinner than the first sheet) side side F3, film covering essentially the faces F2 and F3.
    Alternatively, the transparent film is preassembled with the first sheet before making the through openings in the thickness of the PVB or in the PVB thickness / conductive PET film.
    In FIG. 11 or 1m, use is made of: a first PVB sheet 21 with the through-openings, which sheet may be conventional and / or acoustic and / or tinted. locally, at the periphery, a transparent film (PET, etc.) carrying a functional layer on the face side F3 (or alternatively face F2), for example forming a capacitive touch switch (for turning on the diodes forming a reading lamp), another sheet PVB 23 (thinner than the first sheet) F3 face side adhered by an adhesive 6 '(Figure 1m).
    In FIG. In, use is made of: a first PVB sheet 21 with the through-openings, which sheet may be conventional and / or acoustic and / or tinted, and a second PVB sheet 22 on the F2 side-face, which sheet may be conventional, for example stained, and thinner than the first sheet (taking into account the thickness of the diodes) - the diodes 4 are reverse mount that is to say the light passes in the support 3 (pierced if necessary) glued or against the face F3 .
    In FIG. 10, a first PVB sheet 21 is used with the openings forming blind holes, which sheet may be conventional and / or acoustic
    FIG. 1A shows a partial diagrammatic sectional view, in exploded form, of the laminated glazed roof according to one embodiment of the invention
    It differs from that shown in FIG. 1 "in that the through opening is common to diodes and a spacer is between the diodes 4.
    FIG. 2 shows a partial diagrammatic sectional detail view of the laminated glazed roof 200 'according to one embodiment of the invention.
    Each diode, preferably of power for the reading light, is an electronic component including the semiconductor chip 41, and is equipped with a peripheral envelope 42 (often called "packaging"), polymeric or ceramic, encapsulating the edge of the electronic component The lamination interlayer (by creep during the lamination) may extend to be between the so-called front surface 42 'of the envelope and the face F3 without going to the front face 40 of the diode (emitting face of the chip or more precisely face of the chip assembly and protective covering material or 43 wavelength conversion function (phosphor) .The envelope may have a flared profile 42a away from the chip 41.
    The electronic component 4 thus generally comprises a base 42b here called lower part of the carrying envelope of the chip-semiconductor and a reflector flared towards F3, here an upper portion 42a of the envelope.
    The material 43 may be a transparent resin and / or a mixture with a luminophore
    The phosphor may be just on the chip 41. The material 43 may be flush with the surface (reflector) 42a, including creating an air gap that may be useful.
    Examples of diodes are described in the document "leds for the lighting of Laurent Massol" Edition dunod on pages 140; The lamination interlayer may extend to be between said front surface 42 'of the envelope and the face F3 without being in contact with the emitting face of the chip or the surface 40. The envelope is for example epoxy or ceramic. A polymeric envelope may eventually settle (the final thickness after lamination may be less than the initial thickness) during the lamination. The (polymeric) envelope may be opaque.
    On the rear face of the diode (of the envelope), there are two electrical contact surfaces 44 on zones 33 (isolated by etching 33 ', etc.) of an electroconductive layer 33 on the support 3.
    FIG. 2 'shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention which differs from FIG. 2 in that the rear PVB sheet (against F2 face) is removed and replaced by glue 6.
    FIG. 3 shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention which differs from FIG. 2 in that the rear PVB sheet (against F2 face) is removed and even the diode support because the connections are a layer 18 (insulated areas 18 ') on the face F2.
    FIG. 3a shows a partial diagrammatic sectional detail view of the laminated glazed roof 30 'according to an embodiment of the invention which differs from FIG. 1a by the absence of peripheral surround, the textured plate is glued by an adhesive 62 on the envelope 42a (surface 42 ').
    FIG. 4a shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention which differs from FIG. 1a in that the diodes are reverse-mounted so with a diode support 3 F3 side face (glued via an adhesive 6 to the face F3) and the contacts 44 are connected by side contacts 45 as metal fins to the connection tracks on the back side (towards F2) of the support. The support can be pierced to allow (better) to pass the light.
    Figures 4b and 4c are examples of the reverse-mounted diodes respectively seen from below or in perspective.
    FIG. 5a shows a partial diagrammatic sectional detail view of the laminated glazed roof according to a variant of the embodiment of the invention of FIG. 4a in which the diode support is removed and the contacts 44 are connected by lateral contacts. 45 as metal fins to the connection tracks 18 with insulation 18 'on the face F3.
    FIG. 6a shows a partial diagrammatic sectional detail view of the laminated glazed roof according to one embodiment of the invention; a variant of the embodiment of the invention of FIG. 4a in which the front face of the support is laminated to the face F3 by a PVB sheet 23.
    权利要求:
    Claims (15)
    [1" id="c-fr-0001]
    1. Luminous laminated glass roof of a vehicle including automobile (1000) comprising; - A laminated glazing comprising: - a first transparent glazing (1), mineral glass, optionally tinted, with main faces (11, 12) called faces Fl and F2; glazing intended to be the external glazing, - - a second transparent glazing (1 ') made of mineral glass, optionally stained with principal faces (13, 14), called faces F3 and F4, glazing intended to be the interior glazing - between the faces F2 and F3, which are the internal faces of the laminated glazing unit, an interlayer film of transparent laminating, optionally stained, of polymeric thermoplastic material (2, 20), interlayer laminating film having a main face FA side face F2 and a main side FB side F3, - at least one inorganic light-emitting diode or preferably a set of N> 1 light-emitting diodes (4), each diode having at least one semiconductor chip (40), each diode being able to emit in the direction of the face F3 characterized in that-said lamination interlayer being provided between the face FA and the face FB of one or a set of M openings which are through (20a) or blind holes (20i), each diode being of thickness e2 being submillimetric and being housed in a through opening or a blind hole, in that each diode is associated with a through opening or a blind hole surrounding the wafer of the diode or in that at least one group of said diodes being associated with the same common through opening or a so-called common blind hole.
    [2" id="c-fr-0002]
    2. Glazed laminated glass roof vehicle according to the preceding claim characterized in that each diode is an electronic component (40) equipped with a peripheral envelope (42), in particular polymeric or ceramic, encapsulating the edge of the electronic component, including envelope defining the edge of the diode, projecting and surrounding the semiconductor chip, the lamination interlayer extends to be between the front surface (42 ') of the envelope and the face F3, possibly the electronic component (40) has a so-called lower portion carrying the chip-semiconductor (s) and with a flared upper part towards F3.
    [3" id="c-fr-0003]
    3. Laminated vehicle bright luminous glass roof according to any one of the preceding claims characterized in that a flexible support said diode support (s) (3) is glued or pressed against the face F2 or face F3 in reverse mounting of diodes, support diode (s) of thickness e2 is at most 0.15mm and even at most 0.1mm.
    [4" id="c-fr-0004]
    4. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that it comprises a sheet of thermoplastic material, preferably PVB, between the rear face of the diode support (s) and the face F2 or the face F3 in reverse mounting of the diodes, preferably sheet thickness of at most 0.4mm.
    [5" id="c-fr-0005]
    5. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the opening preferably through is in a thickness of PVB.
    [6" id="c-fr-0006]
    6. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the aperture preferably through is in a interlayer acoustic lamination.
    [7" id="c-fr-0007]
    7. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the aperture preferably through is in a tinted interlayer.
    [8" id="c-fr-0008]
    8. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the through opening is in a composite material; PVB / transparent plastic film or PVB / transparent plastic film / PVB. said plastic film, in particular a PET, of submillimetric thickness carrying a functional coating low emissivity or solar control and / or heating.
    [9" id="c-fr-0009]
    9. Luminous laminated glass roof vehicle according to any one of the preceding claims characterized in that the diode support (s) (3) comprises a transparent film of plastic material, preferably poly (ethylene terephthalate) or polyimide, the electrical circuit is provided with preferably transparent conductive tracks.
    [10" id="c-fr-0010]
    10. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the diode support (s) (4) extends at least to the edge (10) of the laminated glazing, and between the face rearward (30 ') of the diode support (s) and the face F2, is housed a liquid-tight adhesive (6) with a thickness of at most 0.1 mm and better still at most 0.05 mm, in particular a double-sided adhesive,
    [11" id="c-fr-0011]
    11. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the support of the method (s) essentially covers the faces F2 and F3 and preferably carrying a functional coating low emissivity or solar control and / or heating.
    [12" id="c-fr-0012]
    12. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that diodes of said assembly forms a reader and are preferably in through openings and / or on the diode support between the face F2 and the face FA .
    [13" id="c-fr-0013]
    13. Luminous laminated glass roof vehicle according to one of the preceding claims characterized in that the diode forms a light indicator of a touch switch remote side F3 face and facing the diode, the diode forms said indicator light is preferably on the diode support having diodes of said set between the face F2 and the face FA.
    [14" id="c-fr-0014]
    14. Vehicle comprising at least one luminous glazing pane according to any one of the preceding claims.
    [15" id="c-fr-0015]
    15. A method of manufacturing the roof according to one of the preceding roof claims characterized in that it comprises the following steps; cutting of a PVB sheet or a composite PVB / functional plastic film or PVB // functional plastic / PVB film of at most 0,9mm to form one or more local apertures, preferably through-through, - assembly of the laminated glazing unit , with openings preferably wider than the size of the diodes preferably greater than 0.5mm or even more than 0.1mm with a possible second sheet between the rear face of the diode support and the face F2 or face F3 if reverse mount diode.
    类似技术:
    公开号 | 公开日 | 专利标题
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    同族专利:
    公开号 | 公开日
    RU2018146016A|2020-06-26|
    MX2018014505A|2019-05-23|
    CN107848269A|2018-03-27|
    RU2018146016A3|2020-09-08|
    US10639869B2|2020-05-05|
    CA3025132A1|2017-11-30|
    EP3463868A1|2019-04-10|
    FR3051715B1|2021-04-02|
    US20190193376A1|2019-06-27|
    MA45361A|2019-04-10|
    JP2019519422A|2019-07-11|
    RU2742637C2|2021-02-09|
    CN107848269B|2021-04-20|
    KR20190011262A|2019-02-01|
    WO2017203170A1|2017-11-30|
    BR112018074285A2|2019-07-16|
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    法律状态:
    2017-05-24| PLFP| Fee payment|Year of fee payment: 2 |
    2017-12-01| PLSC| Publication of the preliminary search report|Effective date: 20171201 |
    2018-05-22| PLFP| Fee payment|Year of fee payment: 3 |
    2019-05-22| PLFP| Fee payment|Year of fee payment: 4 |
    2020-05-28| PLFP| Fee payment|Year of fee payment: 5 |
    2021-05-31| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1600850A|FR3051715B1|2016-05-26|2016-05-26|LUMINOUS SHEET GLASS ROOF OF VEHICLE, INCORPORATED VEHICLE AND MANUFACTURING|MA045361A| MA45361A|2016-05-26|LUMINOUS SHEET GLASS ROOF OF VEHICLE, INCORPORATED VEHICLE AND MANUFACTURING|
    FR1600850A| FR3051715B1|2016-05-26|2016-05-26|LUMINOUS SHEET GLASS ROOF OF VEHICLE, INCORPORATED VEHICLE AND MANUFACTURING|
    BR112018074285A| BR112018074285A2|2016-05-26|2017-05-24|vehicle luminous laminated glass roof, vehicle incorporating the same and manufacture|
    CA3025132A| CA3025132A1|2016-05-26|2017-05-24|Illuminated laminated sunroof for vehicle, vehicle incorporating same, and manufacture|
    MX2018014505A| MX2018014505A|2016-05-26|2017-05-24|Illuminated laminated sunroof for vehicle, vehicle incorporating same, and manufacture.|
    JP2018561649A| JP2019519422A|2016-05-26|2017-05-24|Luminescent laminated glazing roof for a vehicle, a vehicle incorporating the same, and manufacture of the glazing roof|
    CN201780001449.1A| CN107848269B|2016-05-26|2017-05-24|Luminous laminated glass roof for vehicle, vehicle equipped with it and manufacture|
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